▪ Room or elevated temperature cure

▪ Low exotherm and stress during curing

▪ High thermal conductivity

▪ high temperature resistance

▪ Non-flammable

▪ Battery package assembly

▪ Communication electronics

▪ Mixing: mix the two parts with ratio of 1:1 by volume, Handheld cartridges or automatic dispense are recommended for accurately mixing.

▪ Applying: clean the substrates and apply the mixed adhesive, join the parts and add enough pressure until the handling strength is reached.

▪ Curing: the mixed adhesive will reach full cure in 2-3 days at  room temperature. Cure can be accelerated with elevated temperature like 80°C for 1.5-2 hours, the bonding performance  can be improved by higher temperature curing.

▪ Shelf life of each component is 6 months from date of manufacture when stored at 15-30°C in original unopened container.