EP1360/D25-Shanghai Kleber New Material Technology Co., Ltd

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EP1360/D25

Product Introduction：

KLEBER KB-XERM EP1360/D25 is a two-component epoxy encapsulant material designed for electronic applications. It can be cured at room temperature or quickly at higher temperatures to provide thermal conductivity and bonding.

Features and Benefits：

▪ Thermal conductivity

▪ Low viscosity and easy to use

▪ Reliable for environment test

▪ Wide temperature range（-40℃~125 ℃）

Typical Properties：

Properties	Unit	Part A	Part B	Mixed
Appearance	-	Gray liquid	Transparency liquid	Gray liquid
Viscosity @ 25°C	cps	50000-70000	50-150	3000-5000
Specific Gravity	g/cm³	2.00	1.00	1.82
Mix Ratio by weight	-	10	1	-
Working life @ 25°C	min	-	-	40-60
Gel time @ 25°C	h	-	-	2
Curing time @ 25°C	h	-	-	24
Curing time @65°C	min	-	-	45-50
Curing time @125°C	min	-	-	15-20

Typical Cured Properties：

Properties	Unit	Test Method	Value
Thermal Conductivity	W/m·K	ASTM D5470	1.3
Hardness	Shore D	ASTM D2240	84
Lap Shear Strength, Aluminum @ 25°C	MPa	ASTM D1002	14
Tensile Strength	MPa	ASTM D638	32
Elongation at Break	%	ASTM D638	3
Glass Trannsition Temperature	°C	DMA	65

Application：

▪ Heat pipe bonding

Operation Process：

▪ Mixing and apply: Thoroughly stir each component prior to use. Mix the EP1360 and D25 parts at a ratio of 10:1 by weight with manual or automatic mix equipment. Vacuum system is recommended to avoid any air entrapment during the mixing and applying.

▪ Curing: The mixed encapsulant can be cured according to one of the following schedules:

25℃ 24h

65℃ 45-50 min

125℃ 15-20 min

Shelf Life/Storage：

▪ Shelf life of each component is 1 year from date of manufacture when stored at 15-30°C in original unopened container.