● Thermal conductivity 4.0 W/m· K 

●  Goodflowability and easy handling 

●  Suitable for room temperature and heat curing 

●  RoHScompliant

● Consumerelectronics, communication equipment 

●  Printed circuit board assemblies, housing connections 

●  Automotive electronics 

●  Military electronics

● Weighing: first, stir each container to avoid precipitate, then correctly weigh part A and part B. 

● Mixing: pour part B into part A and mix. 

●  Potting: apply adhesive mixture onto electronic component as soon as possible. Or dispensing / printing through a variety of manual or automated processes, into a variety of thicknesses and shapes. 

● Curing: complete curing process may take 10 to 24 hours at room temperature after less than half hour primary curing process. Elevated temperature will accelerate the process time.

● 40kggroup: Acomponent 20kg/barrel, B component 20kg/barrel. 

●  20kggroup: Acomponent 10kg/barrel, B component 10kg/barrel. 

●  2kggroup: Acomponent 1kg/can, B component 1kg/can

● Sealed at room temperature away from light, and stored in a dry place. 

●  BestStorage conditions: Temperature: 25℃ (±3), Humidity: 50% (±10), can be stored for 3months. 

●  Thematerials taken out after opening may be contaminated during use, so please do notmix contaminated products with unopened products.Nystein assumes no responsibily for contaminated products or conditions other than the required storage conditions. 

●  Foradditional information, please contact your appropriate sales, technical support, orcustomer service representative promptly.