● Roomtemperature curing
● Lowviscosity
● Easyto mix and use
● Heat dissipation
● RoHScompliant
● Acool, dry place for storage, the shelf life is 1year @25°C
● Suchproducts are non-dangerous goods according to transport as common chemicals.
● Packaging: 40 kg suit (Part A20 kg /Part B 20 kg kettle) or 20 kg suit (Part A10 kg /Part B 10 kg kettle) .
● LEDlighting driver
● Power modules / Inverters
● Transformers / Ballasts
● Sensors product
● Electric control units
● Weighing: first, stir each container to avoid precipitate, then correctly weigh part A and part B.
● Mixing: pour part B into part A and mix.
● Potting: apply adhesive mixture onto electronic component as soon as possible.
● Curing: complete curing process may take 10 to 24 hours at room temperature after less than half hour primary curing process. Elevated temperature will accelerate the process time.