In today's world, swept up by the wave of AI, the computational power of data centers is evolving at an unprecedented rate. GPUs, the core of this computational power, are bearing thermal loads like never before. As single-chip power consumption breaks through the kilowatt mark, thermal design is no longer just an auxiliary aspect but a strategic element determining system stability, energy efficiency, and total cost of ownership.

The high demands for thermal management in AI data centers are primarily reflected in the following aspects:

• High Heat Flux Density: The limited surface area of GPU chips generates astonishing amounts of heat per unit area, requiring Thermal Interface Materials (TIMs) to possess high thermal conductivity efficiency.

• Sustained Dynamic Loading: AI training and inference tasks cause continuous fluctuations in chip power and temperature. This demands materials that can not only handle instantaneous high-temperature spikes but also maintain stable performance over long-term thermal cycling, avoiding hot spots and performance throttling caused by aging or pump-out.

• Long-Term Operational Reliability: Data centers require nearly 100% uptime. Any failure due to degradation of thermal material performance can result in significant losses.

• Compatibility with Automated Production and Compact Spaces: Modern server architectures are highly integrated, requiring materials that can be deployed rapidly in various forms like rolls or sheets and adapt to extremely thin assembly gaps.

KLEBER Phase Change Material PCM850-01

KLEBER Phase Change Material PCM850-01，Tailored for High Heat Flux Density Scenarios

• High Thermal Conductivity & Low Thermal Resistance: The material boasts a high thermal conductivity of 8.5 W/m·K and a low thermal resistance of just 0.03 °C·cm²/W under standard test conditions. These parameters work synergistically to enable efficient heat transfer from the chip to the heatsink.

• Precise Phase Change Behavior: With a phase change point set at 50°C, it achieves full interface wetting early when the GPU enters its operational state, minimizing the interface temperature differential.

• Long-Term Stability: The material exhibits excellent anti-pump-out properties and thermal aging resistance, ensuring no degradation in thermal performance throughout performance throughout the expected device lifecycle.

• Engineering Compatibility: The product is available in thicknesses as low as 0.125 mm and comes in rolls, sheets, and custom shapes to suit various needs, from automated production lines to complex, compact structures.

Typical Applications for KB-PCM850-01: High-performance computing chips, IGBT cooling modules, Automotive electronics.

KLEBER PCM850-01 Performance Parameters

Thermal Performance: Graph showing PCM850-01 Thermal Resistance vs. Pressure

Reliability: Performance Test Comparison: KLEBER PCM850-01 vs. A Classic Phase Change Material 79XX:

(1) Changes in mass and thickness of the TIM sandwich structure after 1000 cycles of thermal shock testing.

(2) Performance after 1000 hours of 85°C / 85% RH aging.

Ease of Production and Assembly

• Adhesion at Room Temperature Simplifies Assembly: Possessing a soft texture and moderate surface tackiness at room temperature, the material allows for easy manual pre-attachment or precise positioning, enhancing assembly line efficiency.

• Supplies in Multiple Forms: Can be provided as rolls, sheets, or custom die-cut shapes based on customer requirements, offering equal convenience for both automated production lines and manual assembly.

• Flex Flexible Thickness Options: The product supports multiple thickness specifications, with the thinnest option reaching 0.125 millimeters, providing greater design freedom for slim electronic devices.

• Convenient Rework and Maintenance: When repair or component replacement is necessary, the cured material can be cleanly peeled off, typically without leaving stubborn residue on the attachment surfaces, reducing later maintenance difficulty and cost.

With the rapid development of industries such as Artificial Intelligence, 5G, 6G, automotive electronics, and autonomous driving, the swiftly increasing power consumption of chips and components places higher demands on thermal management technologies – lower interfacial thermal resistance, better long-term reliability, and compatibility with higher power densities. Leveraging their unique properties – ease of processing and installation at room temperature and excellent gap-filling capability leading to very low thermal resistance at operating temperatures – Phase Change Materials are gradually becoming an indispensable part of thermal design for high-power electronic equipment. The development of KLEBER KB-PCM850-01 is based on a profound understanding of the thermal management scenarios within AI data centers. KLEBER is continuously increasing R&D investment, focusing on optimizing material formulations, expanding application scenarios, and refining production processes. We are committed to promoting the large-scale application of phase change materials in more critical