The 2025 Asia Photonics Expo kicked off in Singapore on February 26, where Kleber·Nystein made a notable appearance by showcasing its technological achievements and application cases in thermal interface materials, EMI shielding materials and adhesives. The exhibition garnered widespread attention from industry experts and partners.

In the field of thermal management for optoelectronic devices, Kleber·Nystein introduces composite materials featuring ultra-low thermal resistance and long-term stability, effectively addressing heat dissipation challenges in 5G base stations and optical module equipment. The EMI shielding material series, designed with customized structural solutions, provides high-efficiency EMI protection for optical communication systems and smart wearable devices. Additionally, its self-developed high-temperature-resistant adhesive maintains exceptional bonding performance under complex operating conditions and has already been successfully applied in multiple optoelectronic module packaging projects.

The event not only highlighted Kleber·Nystein technological capabilities but also facilitated in-depth discussions with industry peers on how material innovation can drive the advancement of the optoelectronics sector. Moving forward, the company will continue to deepen its expertise in functional materials, prioritizing customer-centric solutions to help overcome global bottlenecks in photonics technology development.