March 26–28, 2025 | Booth 1568, Hall W1, Shanghai New International Expo Center

Kleber·Nystein showcased its core products and solutions, including Thermal Interface Materials, Adhesives & Potting Materials, and EMI Shielding Materials, at the 2025 Productronica Shanghai. On the opening day, the booth of Kleber·Nystein drew large crowds, attracting professionals from automotive, new energy, telecom, AI, and other industries for in-depth technical exchanges.

Highlighted Innovations Across Three Key Fields

1. Thermal Interface Materials

TG860F High-Performance Fluid Thermal Gel: Solves thermal challenges in high-power-density devices (e.g., security modules, optical transceivers) with ultra-low thermal resistance and long-term stability. S60T Ultra-Thin Insulation Pad with High-Conductivity: Newly launched with 6.0 W/m·K thermal conductivity, tailored for complex new energy applications demanding high power, extreme heat dissipation, and electrical insulation.

2. Adhesives & Potting Materials

High-Strength Structural Adhesive: Designed for new energy vehicles, aerospace precision components and automotive electronics potting materials, demonstrates reliability under extreme environmental conditions.

3. EMI Shielding Materials

Customized Solutions: ECE503 Nickel-Carbon Conductive Elastomer and AB1000 High-Thermal-Conductivity Absorber ensure efficient EMI protection for intelligent wearables and optical communication devices.

With strategic vision “Global Presence, Local Service”, Kleber·Nystein continues to strengthen R&D investments and refine its global strategic layout. The success at Productronica Shanghai 2025 reaffirms its commitment to innovation. Moving forward, we will remain customer-centric, driven by technological breakthroughs, to deliver smarter, more efficient material solutions and propel the industry into a new era of green and intelligent manufacturing.