At the ADHESIVES & BONDING EXPO, North America’s premier event for adhesives and bonding technologies, KLEBER made its mark with the theme "Technology-Driven Industrial Upgrading." The company unveiled innovative bonding solutions across multiple sectors, including automotive, drones, and thermal management, showcasing its cutting-edge technological capabilities and scenario-based product portfolio. This prominent presence made KLEBER a highlight of the exhibition.

Automotive Sector: Lightweighting + Performance Enhancement

Addressing the automotive industry’s stringent demands for lightweighting, premium quality, and reliability, KLEBER introduced two flagship solutions:

1. Carbon Fiber Rearview Mirror Housing Bonding Solution – AA510:

Achieves the perfect balance of "lightweight and high-strength" – significantly reducing weight compared to metal alternatives while ensuring structural rigidity and impact resistance. This solution unlocks creative possibilities for integrating automotive exteriors with vehicle design.

2. Automotive Spoiler Bonding – UA602:

Tailored for aerodynamic components, this solution focuses on "reliable bonding and weather resistance." The customized adhesive enables high-strength bonding on complex curved surfaces, maintaining excellent performance even in extreme environments. It empowers automakers to develop premium models that excel in both aesthetics and performance, accelerating the evolution of automotive design toward "personalization and lightweighting."

Low-Altitude Economy: Precision Bonding for Power Systems

As drones transition from "niche gadgets" to essential tools for logistics, surveying, and inspection, the "stability and efficiency" of their power systems become critical. KLEBER’s adhesive EA2030, designed for drone power systems, achieves seamless bonding between motor stators and housings with ultra-fine precision and vibration/temperature resistance. This not only reduces energy loss and extends battery life but also ensures precise control under high-frequency vibrations. EA2030 injects core momentum into the "essentialization" of the low-altitude economy.

Thermal Management Solutions: AA1003 and EP1360/D25

Amid the surge in power density in consumer electronics and industrial equipment, KLEBER addresses industry challenges where thermal performance bottlenecks limit product efficiency:

1. Heat Sink Bonding – AA1003:

Achieves dual breakthroughs in "high-strength bonding and efficient thermal conductivity" for heterogeneous substrates like aluminum and copper. In servers and new energy power control systems, it enables "rapid heat flow and directional dissipation," ensuring long-term stability and laying a solid thermal management foundation for the era of "computing power explosion and energy upgrades."

2. Heat Pipe Bonding – EP1360/D25:

Solves the challenge of precisely bonding "ultra-thin and irregular-shaped heat pipes." The adhesive layer thickness can be controlled at the micrometer level while significantly reducing thermal resistance. This provides compact and efficient thermal pathways for devices like laptops and 5G base stations, where "space is tight and heat generation is intense," driving end products toward "slimmer designs and higher performance."

From automotive lightweighting to the rise of the low-altitude economy, and from consumer electronics evolution to industrial equipment upgrades, KLEBER exemplifies the core value of "bonding" in industrial advancement through scenario-specific customization and forward-looking technology. The Detroit exhibition not only showcased technological achievements but also extended KLEBER’s invitation to global partners: Together, we will continue to leverage bonding technology as a fulcrum to push the boundaries of innovation across industries. We look forward to exploring new possibilities with you!